Samsung Patents a Single-Substrate Growth Method for Full-Color Micro LED Displays
One of the biggest manufacturing headaches in micro LED display tech is growing red, green, and blue pixels separately and then assembling…
Every patent we've covered
All Big Tech patents
Every newly published filing from Apple, Google, Microsoft, Meta, Nvidia, Tesla, OpenAI, and Amazon — broken down in plain English. Sorted by publication date, newest first.
Samsung Patents a Robot Vacuum That Physically Moves Obstacles to Clean Beneath Them
Most robot vacuums politely drive around shoes, bags, and pet bowls — Samsung's new patent describes a robot that just moves them…
Samsung Patents an Auto-Focusing Liquid Crystal Lens Assembly for Wearables
Samsung has filed a patent for a wearable lens system that can physically move *and* electronically change its focus — using a…
Samsung Patents a Pocket-Detection System for Foldable Phones
Samsung is filing patents to solve one of the most mundane-but-maddening problems with foldable phones: the screen you can still see on…
IBM Patents a Shared-Layer System for Running Multiple Fine-Tuned AI Models at Once
Running dozens of fine-tuned AI models simultaneously is expensive — each one wants its own copy of the same giant base model…
IBM Patents an AI System That Writes Software Test Cases from Requirements Docs
Writing test cases is one of software development's most tedious chores — and IBM is betting a combination of knowledge graphs and…
IBM Patents a Context-Aware Query Rewriting System for RAG
RAG systems are only as good as the question you ask them — and most questions are underspecified. IBM's new patent tackles…
Red Hat Patents a System That Toggles OS Features Based on Energy Use
Red Hat wants Linux to know when it's running low on power — and automatically shut off OS components that aren't worth…
IBM Patents a Probability-Map Approach to Finding Objects in Images
IBM is patenting a way to find objects in images without training a massive model from scratch — instead, you just show…
IBM Patents a Co-Packaged Optical Module for High-Density Chip Interconnects
As AI clusters demand ever-faster chip-to-chip links, IBM is patenting a way to embed optical hardware directly inside a chip package —…
One Big Tech patent. Every Sunday. Free.
Plain English, intelligent commentary, no hype.