Samsung Patents a Voltage-Sensing Protection System for Gas Cooking Appliances
A gas burner's ignition system is surprisingly vulnerable to electrical spikes — Samsung's latest patent describes a smart circuit that steps in…
600 filings · topic
Latest semiconductor & chip patents
From processors and AI accelerators to the packaging and cooling that hold them together, this is where the silicon race lives. Every chip filing, decoded without the jargon.
Recent filings
600 total
Samsung Patents a Dual-Stack Semiconductor Package With Separate Wiring Paths
Samsung has filed a patent for a semiconductor package that stacks two groups of chips on top of each other — but…
Samsung Patents a Heat-Resistant Shielding Structure for Semiconductor Packages
Soldering chips onto circuit boards creates a heat problem — the same heat that bonds the chip can damage the shielding around…
Samsung Patents an Improved Phase-Shift EUV Mask for Chip Patterning
Samsung is patenting a redesigned mask for extreme ultraviolet lithography — the process that etches today's most advanced chips — with a…
Samsung Files Patent for Selective-Protection Semiconductor Etching Process
Deep inside a chip factory, the difference between a working transistor and a dead one can come down to a single masking…
Samsung Patents a Self-Calibrating Radar Receiver That Fixes Its Own Signal Distortion
Radar chips are only as accurate as their analog circuitry — and that circuitry is never perfect. Samsung's new patent describes a…
Samsung Patents an On-Chip Circuit for Testing Interconnect Health
As chips get smaller and the wires connecting their components shrink to nanometer scales, verifying those connections without destroying the chip becomes…
Samsung Patents a Multi-Grating Overlay Measurement Method for Chip Fabrication
Getting semiconductor layers to line up within a few nanometers across an entire wafer is one of the hardest problems in chip…
IBM Patents a Tapered Contact Structure for Next-Gen Nanosheet Transistors
As transistors shrink to nanosheet dimensions, the tiny metal contacts that carry current in and out become a serious engineering headache. IBM's…
IBM Patents a Hybrid Bonding Structure to Pull Heat Out of Stacked Chips
As chips get stacked closer together, heat has nowhere to go — and that thermal buildup is quietly becoming one of the…
IBM Patents a Transistor-Swapping Trick to Shrink Chip Cell Layouts
IBM has found a clever workaround for a rigid constraint in chip layout tools — temporarily disguising one type of transistor as…
IBM Patents a Vertically Stacked P-N Diode Built Into FET Gate Structures
IBM has filed a patent for a P-N diode that lives inside the same physical space as a transistor's source and drain…
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