Samsung Patents a Multi-Adhesive Layer Design for Stacked Semiconductor Packages
Stacking memory chips sounds simple until you realize that keeping them mechanically stable, thermally compliant, and electrically connected at microscopic scales is…
600 filings · topic
Latest semiconductor & chip patents
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Recent filings
600 total
Samsung Patents a Stacked-Layer Transistor Design for Advanced Semiconductors
Samsung is patenting a transistor architecture where stacked semiconductor layers deliberately vary in thickness — a structural tweak that could influence how…
Samsung Patents a Digital Twin System for Semiconductor Process Optimization
Building a chip is extraordinarily sensitive — tiny variations in temperature, pressure, or chemistry during fabrication can silently degrade a product that…
Samsung Patents a Stacked 2D-Material Transistor with Vertical Channel Bridges
Samsung is patenting a transistor design that stacks multiple 2D semiconductor channels — like sheets of atomically thin material — both horizontally…
Samsung Patents a Structural Defense Against Crack Spread in Semiconductor Chips
Cracks in semiconductor chips aren't just cosmetic — they can silently kill a device long after it leaves the factory. Samsung's latest…
Samsung Patents a Gate-Bridging Architecture for Next-Gen Nanosheet Transistors
Samsung is patenting a clever structural trick that electrically ties together gate electrodes sitting on opposite sides of an isolation wall —…
Samsung Patents a Symmetrical Magnetic Field Design for Chip Coating Equipment
Chip manufacturing lives or dies on coating uniformity — and Samsung's latest patent targets a surprisingly overlooked weak point: the magnetic field…
Samsung Patents a Two-Level Gate Wiring Layout for Semiconductor Devices
As chips shrink to atomic scales, routing electrical connections between transistors becomes a puzzle in three dimensions. Samsung's latest patent tackles exactly…
Samsung Patents Semiconductor Package With Embedded Chip Capacitors in Substrate
Samsung is filing patents on a packaging technique that buries capacitors inside the circuit substrate itself — not on top of it…
Samsung Patents a Barrier Structure to Protect 3D Memory Wordlines
As memory chips get denser and more three-dimensional, the manufacturing steps used to etch one part of the chip can accidentally damage…
Samsung Patents a Stacked Nanosheet Transistor Design with Built-In PN Junction
Samsung is filing patents on a way to stack two sets of transistors on top of each other, separated by a special…
Samsung Patents a Two-Layer 2D Semiconductor Channel Design for Next-Gen Chips
Samsung is working on a way to keep ultra-thin, atom-scale semiconductor channels from peeling off their substrates — a surprisingly tricky problem…
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