Samsung Patents a Chip Package That Buries Passive Components Inside Camera Modules
Samsung is patenting a way to hide the small resistors and capacitors that normally crowd a circuit board inside the chip package…
298 filings · category
Chip patents
From processors and AI accelerators to the packaging and cooling that hold them together, this is where the silicon race lives. Every chip filing, decoded without the jargon.
Recent filings
298 total
Samsung Patents a Polarization-Based Focal Plane Array for LiDAR Sensors
Samsung is rethinking how LiDAR sensors send and receive light — by using a clever polarization trick to keep outgoing laser pulses…
Nvidia Patents a System That Spots Duplicate 3D Objects and Collapses Them Into One
Imagine a virtual city with ten thousand trees — most of them nearly identical. Nvidia's new patent describes a way to automatically…
Qualcomm Patents a Video Noise Filter That Knows When to Leave the Picture Alone
Most video noise filters run all the time, blurring fine detail even in clean footage. Qualcomm's new patent describes a system smart…
Qualcomm Patents a Video Decoder That Stops Waiting for Data to Arrive in Order
Qualcomm's latest patent targets a surprisingly mundane but costly problem in video decoding: processor cores sitting idle while waiting for the 'right'…
Intel Patents a Way to Stop AI Chips from Waiting on Their Own Memory
Every time an AI model runs, it has to move enormous tables of numbers — called weights — from storage into the…
Intel Patents a Faster Way to Track Which CPU Cores Still Have Room
Scheduling work across dozens of CPU cores sounds simple — until you have to do it thousands of times per second without…
Intel Patents a Way to Make Your Car's CPU Work Harder When It Matters
Your car's processor doesn't need to work the same way when you're parked as when you're navigating a highway at 70 mph.…
Intel Patents a GPU That Converts Textures Once and Remembers Them
Intel has filed a patent for a GPU-side system that converts textures into the right format on the fly — and then…
Samsung Patents a Higher-Melting-Point Solder Guard for Chip Packages
Solder bumps are one of the most failure-prone parts of a chip package — they melt, crack, and oxidize under heat. Samsung's…
Samsung Patents a Multi-Adhesive Layer Design for Stacked Semiconductor Packages
Stacking memory chips sounds simple until you realize that keeping them mechanically stable, thermally compliant, and electrically connected at microscopic scales is…
Samsung Patents a Stacked-Layer Transistor Design for Advanced Semiconductors
Samsung is patenting a transistor architecture where stacked semiconductor layers deliberately vary in thickness — a structural tweak that could influence how…
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